Waterborne Epoxy Dispersions and Curing Agents

Xyjiao® Lep2055A

Waterborne Bisphenol A Epoxy Dispersion

Lep2055A is a waterborne bisphenol A epoxy dispersion for adhesive formulations, used with a compatible curing agent.

Description

Lep2055A has low odor and good mechanical stability. When mixed with a compatible curing agent, it forms a dense cured film with a high crosslink density, combining good hardness, flexibility and mechanical strength with good adhesion to a range of metal substrates. In high-performance adhesives, it offers fast drying after mixing with a curing agent and water, corrosion, acid and alkali resistance after curing.

Packaging and Storage

Packed in 50 kg/200 kg drums. Store at 10–30°C in a cool, ventilated area, away from ignition and heat sources. Avoid prolonged storage below 0°C and protect from freezing. Reseal after opening if any product remains. Warranty period: 1 year.

Technical parameters

NameValue
AppearanceMilky-white liquid
Solids content55±2%
Epoxy equivalent weight (as supplied)810–1000 g/eq
pH6.0–8.0

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