Waterborne Epoxy Dispersions and Curing Agents

Xyjiao® Lep-5170A

Waterborne Bisphenol A Epoxy Dispersion

Lep-5170A is a solvent-free waterborne bisphenol A epoxy dispersion for adhesive formulations, used with a compatible curing agent.

Description

Supplied as a milky-white, nonionic aqueous dispersion, this bisphenol A epoxy resin contains no solvent, has low odor and good mechanical stability, and is an option for adhesive formulations where resin solids and fast drying are selection criteria.

In high-performance adhesives, the cured material provides high crosslink density and good mechanical strength, together with adhesion to various metal substrates. Its corrosion, acid, alkali and water resistance support selection according to the adhesive layer’s adhesion and resistance requirements.

Directions for Use

Use with a compatible curing agent.

Packaging and Storage

Available in 50 kg/200 kg drums. Store in a cool, ventilated place away from ignition sources and heat, at 10–35°C. Avoid prolonged storage below 0°C and reseal after opening if any product remains. Shelf life is 1 year.

Technical parameters

NameValue
AppearanceMilky-white liquid
Solids content70±2%
pH6.0–8.0

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